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Network Board Automotive Coin Embedded PCB Build Up High Layer
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Automotive Network Board Build up High Layer Coin Embedded PCB
 
 

Wirelaid PCB for High Power
Terranix ensures power response over 400A and optimal heat transfer through the PCB. This can be applied to BMS, OBC, LDC parts of HEV, EV vehicles, and it realizes cost reduction by reducing layer counter and PCB size using Wirelaid technology. Terranix is contributing to securing customers advanced technology through the introduction of new PCB technology.

 
specification
 
Base Material FR-4 , Harogen Free , RoHS
No. of Layers 12 ~ 32 L
Board Thickness 40 ~ 128 [mil] 1.0 ~ 3.2 T
Min. Pattern Width 3.2 [mil] 80 [㎛]
Min. Pattern Space 3.2 [mil] 80 [㎛]
Min. Drill Size 8 [mil] 0.2 [mm]
Min. Laser Drill Size  
Surface Treatment ENIG, OSP
Impedance Control 10%
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